top of page
WAVE Next Gen 3D Smart Heat Sinks 33.jpg
Untitled ww.png
WAVE Next Gen 3D Smart Heat Sinks- Prima

HIGH-TECH.

HIGH-QUALITY.

MADE IN AMERICA.

22092015113533US-FLAG.png
Big Heat sink.jpg

​

Supported by the Oklahoma Center for the Advancement of Science and Technology (OCAST) 

Next Gen W.A.V.E. Heat-Sinks

THE MOST ADVANCED COPPER HEATSINKS IN THE WORLD

The Next Gen Wide Area Vectored Exchange (W.A.V.E.) Heat-Sink product line consist of the most advanced and most efficient 3D Manufactured Copper Heat-sinks in the world. The W.A.V.E. product line features the highest “Surface Area Heat-sink Design” in the world to aid in keeping electronics cool and operational for extreme performance. Additionally, “Turbulent Air Flow Design Technology” in the product line promotes turbulent air flow for further cooling applications. Next Gen W.A.V.E. heat sinks are custom Additive Manufactured/ 3D Printed out of pure Copper to retain thermal conductivity of 385 W/m K. No program is “too big” or “too small” for this product line. Research of design funded by the Oklahoma Center for the Advancement of Science and Technology (OCAST) for 2020 and 2021.

IAC_edited.png

Research Partner

PRODUCT SUMMARY

W. Wide A. Area V. Vectored E. Exchange (WAVE) Technology: Utilizing breakthrough(s) in additive metal 3D printing in Copper composites, Casey Corp Defense has synthesized a geometrical pattern which obtains nearly 50% more surface area than similar passive heatsinks in the same SWAP-C. Utilizing Copper composites enables the W.A.V.E heat-sink to reach Thermal conductivity of 385 W/m K. Utilizing 3D additive manufacturing methodology, geometrical patterns found in nature, such as the Oceanic wave, can provide 44.56% longer horizontal cooling, 45.94% longer vertical cooling and 49.72% more surface area for heat exchange.

​

Turbulent Air Flow Design Technology: The "Next Gen W.A.V.E. Heat-Sink" utilizes an advanced 3D geometric wave, a wave that has a designed curved profile on the x-axis, the y-axis, and z-axis; to promote turbulent air flow for cooling applications. This has been proven across several leading studies to dramatically increase heatsinks cooling capabilities [1], [2], [3].

​

U.S. Patent Pending Heatsink Design

Technical Specifications 

Store / Next Gen W.A.V.E. Heat-Sinks: Standard Industrial Profile (.45in Height) / Standard Profile 2in Wide Series
Next Gen W.A.V.E. Heat-Sink "2x8x.45in"
+2

Next Gen W.A.V.E. Heat-Sink "2x8x.45in"

SKU 00012
$850.00
LIMITED PRODUCTION
In stock
1
Product Details

U.S. Patent Pending Heatsink Design

Product Summary:

W. Wide A. Area V. Vectored E. Exchange (WAVE) Technology

Utilizing breakthrough(s) in additive metal 3D printing in Copper composites, Casey Corp Defense has synthesized a geometrical pattern which obtains nearly 50% more surface area than similar passive heatsinks in the same SWAP-C. Utilizing Copper composites enables the W.A.V.E heat-sink to reach Thermal conductivity of 385 W/m K. Utilizing 3D additive manufacturing methodology, geometrical patterns found in nature, such as the Oceanic wave, can provide 44.56% longer horizontal cooling, 45.94% longer vertical cooling and 49.72% more surface area for heat exchange.

Turbulent Air Flow Design Technology

The "Next Gen W.A.V.E. Heat-Sink" utilizes an advanced 3D geometric wave, a wave that has a designed curved profile on the x-axis, the y-axis, and z-axis; to promote turbulent air flow for cooling applications. This has been proven across several leading studies to dramatically increase heatsinks cooling capabilities [1], [2], [3].

Funding Agency: Oklahoma Center for the Advancement of Science and Technology (OCAST)

Pending Funding: U.S. Department of Defense and U.S. Department of Energy

Testing and Evaluations: Being conducted at the Oklahoma State University- Industrial Assessment Center (OSU-IAC)

Purchase Application:

Intended for test and evaluation by Federal Labs, Department of Defense Labs, Department of Energy Labs and Academic University affiliated personnel. Must sign an "end user" agreement.

Technical Specifications:

Thermal Conductivity of 3D Printed Copper*** (W/mK) 390
Mass (lb) 0.80
Mass (grams)
Dimensions (in) (x-y-z)
 2 x 8 x 0.45
Dimensions (mm) (x-y-z) 50.8 x 203.2 x 11.43
Volume (in³)
Volume (mm³)
Surface Area (in²)
Surface Area (mm²)
Center of Mass (in) (x-y-z)
Center of Mass (mm) (x-y-z) *** 3D Printing of Highly Pure Copper: https://www.mdpi.com/2075-4701/9/7/756


Studies Mentioned:

Chamanroy, Z., & Khoshvaght-Aliabadi, M. (2019, September 05). Analysis of straight and wavy miniature heat sinks equipped with straight and wavy pin-fins. Retrieved from https://www.sciencedirect.com/science/article/abs/...

Khoshvaght-Aliabadi, M., Hassani, S., & Mazloumi, S. (2017, August 18). Enhancement of laminar forced convection cooling in wavy heat sink with rectangular ribs and Al2O3/water nanofluids. Retrieved December 15, 2020, from https://www.sciencedirect.com/science/article/abs/...

Lin, L., Zhao, J., Lu, G., Wang, X., & Yan, W. (2017, May 18). Heat transfer enhancement in microchannel heat sink by wavy channel with changing wavelength/amplitude. Retrieved December 15, 2020, from https://www.sciencedirect.com/science/article/abs/...

Show More
Share this product with your friends
Pin it
Next Gen W.A.V.E. Heat-Sink "2x8x.45in"
Display prices in: USD
bottom of page